The specifications for Qseven, COM Express and SMARC include heatspreader definitions, the mechanical thermal interface. All the heat generated by power consuming components such as chipsets and processors is transferred to the system’s cooling via the heatspreader. This can be achieved by either a thermal connection to the casing, a heat pipe or heat sink.
• Cooling Solutions for COM Express
• Cooling Solutions for Qseven and SMARC
• Slim Cooling Solutions for Thin Mini-ITX boards
• Heat spreader and passive cooling solution for Pico-ITX boards